Thermal Management Research Center

The Center promotes research through three specialized technical groups: the Component and System Design Group, the Heat Transfer Device Manufacturing Group, and the Heat Transfer Material Technology Group:

I. Component and System Design Group

This group utilizes thermal simulation and fluid flow analysis to design optimized cooling modules tailored to high-power chips, addressing the heat management challenges of next-generation HPC and AI hardware.

1. Design of vapor chambers, cold plates, and heat sink fins
2. Analysis of heat transfer mechanisms and temperature distribution simulation for chip components
3. Design of single-phase and two-phase heat exchangers

II. Heat Transfer Device Manufacturing Group

By combining AI-driven thermal simulation with advanced machinery, this group overcomes traditional manufacturing constraints to develop high-performance cooling devices for next-generation high-density packaging.

1. Five-axis milling processes and metal microstructure machining
2. Ultrafast laser processing (picosecond/femtosecond) and non-contact micromachining technology
3. Manufacturing platforms for microchannels and high-density heat dissipation structures

III. Heat Transfer Material Technology Group

Focused on material innovation, this group develops thermal interface and structural materials for high-power chip applications, effectively enhancing system cooling efficiency and reliability.

1. Development and modification of liquid metal (e.g., Galinstan) thermal interface materials
2. Improvement of corrosion and weather resistance for heat exchanger materials (Copper, Aluminum)
3. Filler design and rheology control to produce high-$\kappa$ Thermal Interface Materials (TIMs)