Thermal Management Research CenterDesign of Vapor Chambers, Cold Plates, and Heat Sink Fins
Research Content
This research focuses on designing cooling solutions based on the heat generation and heat transfer paths of individual dies within a chip. In a basic electronic chip cooling mechanism, the heat generated by the die is first spread through a vapor chamber (spreader), then transferred to heat sink fins or a cold plate, and finally dissipated into the atmosphere. Thermal Interface Materials (TIMs) must be applied between the die and the vapor chamber, as well as between the vapor chamber and the cold plate or fins, to reduce contact thermal resistance. The foundation of this design lies in understanding the detailed temperature distribution of each die through simulation analysis, and subsequently designing the required heat exchangers, encompassing various types such as vapor chambers, cold plates, and fins.
