Thermal Management Research CenterAnalysis of Heat Transfer Mechanisms and Temperature Distribution Simulation for Chip Components
Research Content
This task is the front-end core of thermal design, focusing on simulating and analyzing the heat transfer mechanisms and temperature distribution of various chip components. Through precise simulation analysis of die temperature distribution, we can understand in detail the temperature profile of each die during operation. These data will directly serve as a crucial basis for subsequent heat exchanger design, ensuring that the design accurately targets the heat sources and formulates appropriate heat exchangers and cooling modules according to actual requirements.
