Thermal Management Research CenterManufacturing Platforms for Microchannels and High-Density Heat Dissipation Structures
Research Content
Through mechanisms such as laser direct writing, selective ablation, or scanning laser-induced etching, this project can establish micrometer-scale, high-density 3D flow channel structures on materials like glass interposers and cermet substrates. This significantly enhances cooling efficiency and provides novel thermal management solutions for future high-density packaging modules. This research introduces a high-power picosecond/femtosecond laser processing system, combined with AI digital thermal simulation and laser path optimization algorithms, to develop a manufacturing platform suitable for highly complex microchannel designs. The goal is to break through traditional processing limits and realize advanced packaging cooling modules with functional integration, high efficiency, and high reliability.
