Thermal Management Research Center

Filler Design and Rheology Control to Produce High-κ Thermal Interface Materials (TIMs)

Research Content

This research aims to enhance the thermal conductivity of LM TIMs by adding metallic and non-metallic fillers into the liquid metal matrix. By modulating the rheological properties of liquid metal, we expand its research and application scope. Combining various comprehensive advantages, liquid metal is expected to become an ideal ultra-high power density heat dissipation material. The ultimate goal of this project is to produce high-κ LM TIMs that meet next-generation requirements, driving the construction of a brand-new technological application system.

Development of High-Conductivity LM TIM
Development of highly thermally conductive LM TIMs with various fillers and establishment of manufacturing processes
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