Thermal Management Research CenterUltrafast Laser Processing (Picosecond/Femtosecond) and Non-Contact Micromachining Technology
Research Content
This project develops high-precision non-contact manufacturing technologies, such as ultrafast laser processing, applied to the manufacturing of next-generation high-performance cooling modules for electronics and semiconductors. As high-power, high-integration chip technologies (e.g., CoWoS, 3D IC, glass interposers) rapidly evolve, traditional contact processing technologies face challenges such as limited microstructure sizes, material wear, and excessively large heat-affected zones (HAZ). These traditional methods struggle to meet the demands of next-generation packaging cooling modules for complex microstructures, high-density 3D flow channels, and heterogeneous material processing. Ultrafast lasers possess extremely short pulse durations and high peak energy, enabling high-precision micromachining of materials like metals, glass, and ceramics with minimal heat-affected zones.
