Thermal Management Research Center

In response to the rapid development of applications such as Artificial Intelligence (AI) and high-performance computing (HPC), the operational demands on data centers and high-power electronic equipment are constantly increasing. Consequently, heat dissipation and temperature control for high-power chips have become critical issues affecting system performance, reliability, and industry development. The thermal management of electronic equipment involves multiple challenges across thermal fluidics, manufacturing, mechanics, materials, and control. It requires cross-disciplinary integration to propose comprehensive and implementable solutions.

In recent years, our university has progressively accumulated faculty and research capabilities related to thermal management. However, most research has been conducted independently by individual laboratories, lacking systematic horizontal integration and resource connection. To consolidate the university's research capabilities in the thermal management of electronic components and equipment, and to integrate internal and external industry-academia-research resources, develop and promote thermal management technologies, provide cooling solutions, and cultivate relevant talents, the College of Engineering officially established the "Thermal Management Research Center" on December 4, 2025.

The Center aims to integrate the university's research capabilities in the thermal management of electronic components and equipment, combining human resources from industry, academia, and research institutions to promote the research, development, and application of thermal management technologies. By providing cooling solutions and technical support, we assist domestic and international industries in addressing various electronic equipment cooling challenges while strengthening the cultivation of thermal management professionals.

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